(module InvenSense_INMP504 (layer F.Cu) (tedit 54875D3A)
  (solder_mask_margin 0.025)
  (solder_paste_margin -0.1)
  (attr smd)
  (fp_text reference InvenSense_INMP504 (at 3.25 0 90) (layer F.SilkS))
  (fp_text value VAL** (at -2 0 90) (layer Cmts.User))
  (pad "" thru_hole circle (at 0 0) (size 1.1 1.1) (drill 0.75) (layers *.Cu *.Mask))
  (pad "" smd circle (at 0 0) (size 1.55 1.55) (layers F.Cu F.Mask))
  (pad 1 smd rect (at 1.52 -0.61) (size 0.9 0.58) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at 1.52 0.61) (size 0.9 0.58) (layers F.Cu F.Paste F.Mask))
)
